Digital engineering has evolved beyond a trendy term—it's now a crucial driver of innovation. Ansys 2025 R1 takes engineering simulation to the next level, making it faster, more intelligent, and highly efficient.
This new release introduces cutting-edge improvements in AI-powered simulations, GPU acceleration, system-level modeling, and cloud capabilities, enabling engineers to break new ground with unprecedented ease.
3D Design
Ansys Discovery 2025 R1 brings advanced new features that streamline the entire design exploration and simulation process.
Model preparation is faster and more intuitive with tools like sweep meshing feasibility detection and custom beam creation. Complex electronics cooling simulations are accelerated through GPU-powered automated meshing and enhanced electromagnetic capabilities.
Plus, with cloud-bursting capabilities, you can run thousands of simulations in just minutes, enabling you to explore more design possibilities with less time and effort.
Additive
We’re excited to unveil the integration of Ansys’ advanced simulation technology with Materialise Magics, a strategic partnership set to reshape the future of metal additive manufacturing.
This collaboration improves product quality, lowers production costs, and accelerates innovation by proactively identifying and addressing risks. By predicting part deformation and thermal stress early in the process, it ensures more accurate, efficient, and reliable manufacturing outcomes.
Autonomous Vehicle Simulation
Ansys AV Simulation 2025 R1 delivers significant enhancements to the safety, efficiency, and usability of autonomous systems.
Key updates include precise 3D sensor placement, robust IP protection for camera imagers, and standardized interconnects for radar sensor interfaces. With improved interoperability and seamless connectivity through AVxcelerate Autonomy, this release ensures smooth integration and greater adaptability.
These advancements drive the autonomous industry forward with secure, high-performance solutions that meet rigorous safety standards and elevate the overall user experience.
Connect
This release strengthens digital engineering enablers by making Materials (Granta) and Simulation (Minerva) data more seamlessly integrated with CAD, CAE, and PLM systems.
An improved user experience enhances search and export functionalities, streamlining workflows. Support for next-generation Model-Based Systems Engineering (MBSE) is expanded with SysML v2 and advanced model management within the Ansys System Architecture Modeler, offering deeper integration with Ansys ModelCenter.
Additionally, Ansys optiSLang™ introduces new distributed computing options and advanced algorithms, boosting flexibility and performance across engineering workflows.
Additive
We’re excited to unveil the integration of Ansys’ advanced simulation technology with Materialise Magics, a strategic partnership set to reshape the future of metal additive manufacturing.
This collaboration improves product quality, lowers production costs, and accelerates innovation by proactively identifying and addressing risks.
By predicting part deformation and thermal stress early in the process, it ensures more accurate, efficient, and reliable manufacturing outcomes.
Digital Twin
Ansys 2025 R1 takes digital twin technology to the next level with enhanced hybrid analytics, scalable deployment, and new features designed for greater flexibility and user-friendliness.
Key updates include the introduction of the Ansys Unified Installer, a scriptable Python interface for Reduced Order Models (ROMs), and improved hybrid analytics post-processing capabilities.
Ansys TwinAI™ now offers support for SysML v2 snippet exports, menu-based help, expanded file export options, and new examples for PyAEDT and PyTwin, making development more streamlined and efficient.
Electronics
Accelerate your time-to-market and fuel innovation with enhanced capabilities that improve simulation speed, accuracy, and user experience.
The new axial-flux machine template boosts meshing precision and efficiency for electric machines. Streamlined TZR speed import and optimized workflows simplify 3D-IC modeling. Benefit from a faster A-Phi Eddy current solver designed for DC-biased frequency domain analysis in power electronics.
Enjoy more flexible and precise system-level simulations, faster IC design evaluations, simplified PI analysis workflows, and AI/ML-powered time and memory predictions to optimize performance.
Embedded Software
Building on the progress of the previous release, Ansys Embedded Software 2025 R1 introduces new advancements that push innovation even further.
Prioritizing software safety certification, the latest version of Ansys SCADE features key improvements in certified and qualified code generation for DO-178C and ISO 26262 safety standards, maintaining its leadership in the automotive and aerospace sectors.
The latest Scade One release offers a comprehensive testing workflow and introduces PyScadeOne, enhancing efficiency and development flexibility.
Fluids
Ansys Fluids 2025 R1 delivers essential updates to meet evolving performance and productivity demands.
The Fluent GPU solver now supports additional physics, including the FGM combustion model, particle and droplet modeling via the discrete phase model (DPM), and surface-to-surface radiation.
Significant performance enhancements, expanded multi-physics integrations, and new optimization features are also available across Thermal Desktop, Rocky, and CFX, ensuring faster, more efficient fluid dynamics simulations.
Materials
Ansys Granta 2025 R1 introduces a host of new features and enhancements, delivering a unified experience for Granta MI users across CAD, CAE, and PLM platforms.
This release includes major improvements in search functionality and adds new material data for polymers, electromagnetics, and sustainability within the material libraries.
These updates help engineers and designers work more efficiently without leaving their preferred engineering environments.
Optics
Ansys Optics 2025 R1 focuses on unified multiphysics analysis, streamlined workflows, and an enhanced user experience.
Key updates include stress birefringence support in STAR, design-for-manufacturing features with mechanical pivot points (MPVT), Pervasive Insights with a new Dark Theme, X-Rite AxF support, a Python-based API, advanced optical lens design for headlamps, multi-GPU performance boosts, meshing improvements, and a modernized UI for Lumerical FDTD.
These enhancements improve simulation accuracy and collaboration, reinforcing Ansys Optics' leadership in optical simulation and design. The updated software is now available on GitHub, simplifying integration into simulation pipelines and custom GUI development.
Safety Analysis
Ansys Safety Analysis 2025 R1 introduces new UX and UI enhancements across its product suite, offering improved workflows and greater efficiency for complex safety projects.
The model-based safety solution now enables faster, more effective FMEA execution with smarter navigation, making it easier to update analyses as hardware evolves.
The Digital Safety Manager (DSM) platform now supports customer-defined safety KPIs, powered by real-time data from Ansys medini, bridging the gap between safety engineers and managers.
This ensures safety analysis becomes an integral, visible part of the product development process.
Semiconductors
Ansys 2025 R1 significantly accelerates performance across the entire semiconductor product line. PowerArtist™ introduces an advanced methodology for identifying and mitigating glitch power, enhancing power efficiency.
The all-new PowerX™ software specializes in parasitic debugging for semiconductor power devices, while RedHawk-SC Security™ has partnered with eShard™ to strengthen side-channel security analytics. Additionally, RedHawk-SC Electrothermal™ has collaborated with TSMC™ to develop a workflow for assessing thermal manufacturing stresses in 3D-ICs, advancing thermal reliability in semiconductor design.
Structures
Ansys Structures 2025 R1 delivers a comprehensive set of new features, offering broad benefits across its product suite. Ansys Mechanical introduces enhanced solver capabilities, seamless NVH (Noise, Vibration, and Harshness) integration, and advanced tools for material behavior and crack growth analysis, enabling engineers to tackle large, complex models with greater accuracy and efficiency.
Ansys LS-DYNA expands its capabilities with new solvers and methodologies for real-world applications, including gas flows, adhesives, and battery systems. Ansys Sherlock focuses on Thermal-Mechanical life predictions for BGA packages, along with updates to PySherlock, featuring new APIs and automated workflows to streamline reliability analysis.
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